| Parameter | Specification |
|---|---|
| Heating Zones | 6 / 8 / 10 Zones (Optional) |
| Cooling Zones | 1 – 3 Zones |
| Heating Method | Hot Air Convection |
| Temperature Range | Room Temp to 300°C |
| Temperature Control Accuracy | ±1°C |
| Conveyor Type | Mesh Belt / Chain Conveyor |
| Conveyor Speed | 0 – 2000 mm/min (Adjustable) |
| PCB Width Capacity | Up to 400 mm (Customizable) |
| Power Supply | 380V, 3-phase, 50/60 Hz |
| Control System | PLC + Touch Screen Interface |
| Cooling Method | Forced Air Cooling |
| Machine Dimensions | Approx. 3000–4500 mm Length |
| Application | SMT PCB Assembly Production |
The Floor Stand Reflow Oven is a high-performance system that is used to solder SMT components with high accuracy and efficiency in medium to large quantities of PCBs. It has a strong floor-mounted frame that will provide stability, longevity, and continuous performance in the industrial setting. This system has several heating zones, which have advanced temperature control that allows precise and even distribution of heat on the PCB. It also has programmable reflow profiles which can be customised to suit various soldering needs. It has a powerful conveyor system, which provides ease in moving PCBs and a high level of consistency in its processing output. The oven also has the latest cooling features to promote reliability of the solder joints. It is easy to operate, monitor and make adjustments on its digital controls and its user-friendly interface. The Floor Stand Reflow Oven, which is ideal in EMS units, manufacturing plants and production lines, enhances productivity, minimises flaws and offers high-quality performance in soldering.
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