Table Top Reflow Ovens
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Table Top Reflow Ovens
Table Top Reflow Ovens  Manufacturers in IMTronics Technology

Table Top Reflow Ovens

Parameter Specification
Heating Zones 4–6 Zones
Control System PID-/Microcontroller-Based
Temperature Range Up to 300°C
Temperature Accuracy ±1–2°C
Conveyor Type Mesh Belt / Rail (Optional)
Heating Method Infrared + Hot Air Convection
Power Supply 220V / 50Hz
Power Consumption 2.5 – 4 kW
PCB Width Capacity Up to 300 mm
Heating Time 10–15 minutes
Cooling System Forced Air Cooling
Display Digital LCD / Touch Screen
Machine Size (Approx.) 900 × 600 × 450 mm
Weight (Approx.) 40 – 70 kg

Table Top Reflow Oven is a small and powerful tool which is applied to precisely solder Surface Mount Technology (SMT) components on printed circuit boards (PCBs). It is best used in the prototyping, research and development laboratory and small- to medium-scale production plants. It has a consistent thermal performance with consistency in the heat distribution to ensure high quality and reproducible soldering results. It has various heating zones and programmable temperature profiles enabling users to work with very many PCB assemblies with precision. The simplicity of operation and real-time monitoring of the process are provided with the help of the intuitive user interface with digital controls. It is also space-saving, with a tabletop layout allowing it to be fitted in a limited workspace without sacrificing performance. It has high safety measures with over-temperature protection and a powerful cooling system that makes it reliable and safe in operation.

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