| Parameter | Specification |
|---|---|
| Heating Zones | 4–6 Zones |
| Control System | PID-/Microcontroller-Based |
| Temperature Range | Up to 300°C |
| Temperature Accuracy | ±1–2°C |
| Conveyor Type | Mesh Belt / Rail (Optional) |
| Heating Method | Infrared + Hot Air Convection |
| Power Supply | 220V / 50Hz |
| Power Consumption | 2.5 – 4 kW |
| PCB Width Capacity | Up to 300 mm |
| Heating Time | 10–15 minutes |
| Cooling System | Forced Air Cooling |
| Display | Digital LCD / Touch Screen |
| Machine Size (Approx.) | 900 × 600 × 450 mm |
| Weight (Approx.) | 40 – 70 kg |
Table Top Reflow Oven is a small and powerful tool which is applied to precisely solder Surface Mount Technology (SMT) components on printed circuit boards (PCBs). It is best used in the prototyping, research and development laboratory and small- to medium-scale production plants. It has a consistent thermal performance with consistency in the heat distribution to ensure high quality and reproducible soldering results. It has various heating zones and programmable temperature profiles enabling users to work with very many PCB assemblies with precision. The simplicity of operation and real-time monitoring of the process are provided with the help of the intuitive user interface with digital controls. It is also space-saving, with a tabletop layout allowing it to be fitted in a limited workspace without sacrificing performance. It has high safety measures with over-temperature protection and a powerful cooling system that makes it reliable and safe in operation.
Strengthen your projects with trusted cooling solutions. Call us for expert guidance.