| Parameter | Specification |
|---|---|
| Model Type | Semi-Automatic Solder Paste Printer |
| Operation Mode | Semi-automatic |
| Printing Area | Up to 300 × 400 mm (customizable) |
| PCB Thickness | 0.2 – 4 mm |
| Alignment Accuracy | ±0.01 mm |
| Repeatability | ±0.02 mm |
| Cycle Time | 10 – 20 seconds per print |
| Squeegee System | Motorized (Speed & Pressure Adjustable) |
| Control System | PLC/Microcontroller-Based |
| Stencil Frame Size | Standard / Custom Sizes Supported |
| Adjustment System | X, Y, θ Fine Adjustment |
| Drive Type | Pneumatic / Electric |
| Power Supply | AC 220V, 50/60 Hz |
| Air Supply | 4 – 6 bar (for pneumatic models) |
| Frame Material | High-Strength Aluminum / Steel |
| Mounting Type | Floor / Bench Mounted |
| Application | PCB Solder Paste Printing |
| Suitable For | SMT Production, Batch Manufacturing, R&D |
| Weight | Approx. 80 – 150 kg |
The Semi Automatic Printer is a high-accuracy device that is intended to provide high efficiency and consistency in the solder paste application in PCB assembly lines. It combines the process of loading PCBs manually and using automated printing procedures and ensures proper alignment of the stencil and a consistent deposition of the paste at each cycle. The motorised squeegee system installed in the machine allows close regulation of the speed and pressure and results in improved print quality and reduced operator dependency.
The flexibility of its parameters and fine adjustment system allows it to be repeated and is applicable in the case of high accuracy requirements. Constructed to have a strong structure and easy-to-use interface, it is compatible in both a small- to medium-sized production setting and a batch manufacturing setting. The system helps reduce the wastage of solder paste, reduce the printing faults and boost productivity.
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