Aqueous based Pallet Cleaner Kyzen E5325M
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Aqueous based Pallet Cleaner Kyzen E5325M
Aqueous based Pallet Cleaner Kyzen E5325M Manufacturers in IMTronics Technology

Aqueous based Pallet Cleaner Kyzen E5325M

Specification Details
Product Name KYZEN E5325 / E5325M
Product Type Maintenance & Pallet Cleaner
Application Maintenance Cleaning
Process Spray / Immersion / Ultrasonic
Concentration 10% – 30%
Temperature Ambient to 140°F / 60°C
Rinse Optional / DI Water
Dry Hot Air
pH (10 g/L) 11
Flash Point None to Boiling
Boiling Point 217°F / 103°C
Water Soluble Complete
VOC @ 10% 0.0 g/L

KYZEN E5325M Aqueous Based Pallet Cleaner is a high-performance maintenance cleaning solution designed for effective removal of difficult flux residues and solder paste from pallets and electronics manufacturing equipment.

The cleaning chemistry is suitable for off-line maintenance cleaning of solder pallets, wave solder fingers, reflow oven parts and associated production tooling. It provides effective cleaning performance even against difficult process residues while requiring minimal exposure time.

KYZEN E5325 is compatible with aluminum, copper and steel, along with standard materials commonly used in reflow oven systems, wave solder equipment and associated tooling. This broad material compatibility makes it suitable for routine maintenance applications across electronics manufacturing facilities.

The solution can be used in spray-in-air, immersion and ultrasonic cleaning systems, providing flexibility for different maintenance cleaning processes. Recommended operating concentration ranges from 10% to 30%, with operating temperatures from ambient up to 60°C (140°F).

E5325 is also a low-odor, zero-VOC cleaning solution. By efficiently removing accumulated process residues, it can help reduce equipment maintenance time and machine downtime while supporting cleaner production tooling.

Key Features

  • Effective removal of difficult flux residues

  • Removes solder paste from production tooling

  • Designed for pallet and maintenance cleaning

  • Suitable for wave solder fingers

  • Suitable for reflow oven parts

  • Compatible with aluminum, copper and steel

  • Suitable for spray-in-air cleaning

  • Compatible with immersion cleaning systems

  • Suitable for ultrasonic cleaning systems

  • Recommended concentration: 10–30%

  • Operating temperature: Ambient to 60°C

  • Low-odor formulation

  • Zero VOC at 10% concentration

  • Completely water soluble

  • Helps reduce maintenance and machine downtime

Applications

  • Solder Pallet Cleaning

  • Wave Solder Finger Cleaning

  • Reflow Oven Parts Cleaning

  • Production Tooling Cleaning

  • Flux Residue Removal

  • Solder Paste Removal

  • Electronics Equipment Maintenance

  • Off-Line Maintenance Cleaning

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