Reflow Oven Cleaner Kyzen C8502

KYZEN CYBERSOLV® C8502 is a high-performance maintenance cleaning solution specially formulated to quickly remove flux residues from reflow oven surfaces, wave solder fingers and general electronics production equipment. It is designed for routine maintenance cleaning in electronics manufacturing environments where flux and process residues can build up on equipment surfaces.

CYBERSOLV C8502 is formulated using a combination of oxygenated solvents and water. The selected solvents provide effective cleaning action against rosin, no-clean and water-soluble wave solder flux residues, helping maintain cleaner production equipment and supporting regular preventive maintenance.

The cleaner is easy to use, non-flammable and virtually odor-free, making it a practical alternative to IPA for equipment maintenance applications. It is supplied at full strength and is typically used at 100% concentration at ambient temperature.

C8502 can be used for manual and immersion cleaning. It may also be used at full strength in immersion systems incorporating spray-under-immersion or ultrasonic agitation. Rinsing is optional, and cleaned surfaces can be air dried.

Key Features

• Quickly removes flux residues

• Suitable for reflow oven surface cleaning

• Effective for wave solder finger cleaning

• Suitable for general electronics production equipment

• Effective on rosin, no-clean and water-soluble flux residues

• Easy-to-use maintenance cleaning solution

• Non-flammable formulation

• Virtually odor-free

• Complete water solubility

• Used at 100% concentration

• Suitable for manual and immersion processes

• Rinse is optional

• Air drying

• Suitable for electronics manufacturing maintenance

Applications

• Reflow Oven Surface Cleaning

• Wave Solder Finger Cleaning

• Electronics Production Equipment Cleaning

• Flux Residue Removal

• General Equipment Maintenance

• Preventive Maintenance Cleaning

• Industrial Component Cleaning