Aqueous based Stencil Cleaner Kyzen E5631

KYZEN E5631 is a ready-to-use understencil wipe cleaning solution specially developed for the effective removal of raw solder paste from SMT stencils. It is suitable for both online and offline stencil cleaning processes, helping maintain clean stencil apertures and consistent solder paste printing performance in SMT production.

E5631 provides an effective alternative to traditional IPA-based stencil cleaning. Its ready-to-use formulation eliminates the need for dilution or concentration control, making it convenient for routine stencil cleaning in electronics manufacturing environments.

The cleaning solution is compatible with commonly used SMT stencils, stencil cleaning equipment and automatic printer systems. It effectively removes solder paste residues while supporting reliable printing quality and reducing contamination buildup on stencil surfaces and apertures.

KYZEN E5631 is completely water soluble and can be used from ambient temperature up to 49°C (120°F). Depending on the cleaning process, DI water or solvent can be used for rinsing, followed by warm-air drying.

Key Features

• Ready-to-use stencil cleaning solution

• Effective removal of raw solder paste

• Designed for online and offline stencil cleaning

• No dilution or concentration control required

• Effective alternative to IPA cleaning

• Compatible with common SMT stencil materials

• Suitable for stencil cleaning equipment and printer systems

• Completely water soluble

• Helps maintain clean stencil apertures

• Supports consistent solder paste printing

• Suitable for SMT and electronics manufacturing

Applications

• SMT Stencil Cleaning

• Understencil Wipe Cleaning

• Online Stencil Cleaning

• Offline Stencil Cleaning

• Raw Solder Paste Removal

• SMT Printing Process Maintenance

• Electronics Manufacturing